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    The global demand for encapsulation resins stood at USD 3.67 billion in 2018, and the market is poised to exhibit a CAGR of over 3.4% during the forecast period. Market Synopsis: Encapsulation is a process where electronics are covered with resins for protecting it from vibration, shock, corrosion, and moisture. Increasing production of electronics is likely to generate more demand for these resins over the next few years. The report circulated by Market Research Future (MRFR) unfolds that the global encapsulation resins market growth is expected to register a CAGR of 3.4% across the projection period 2019 to 2024. In terms of revenue, the market is estimated to touch a valuation of USD 3.67 Bn by 2024. Competitive Dashboard: Aremco (US), Hitachi Chemical Co., Ltd. (Japan), Dow (US), Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), BASF SE (Germany), Huntsman International LLC (US), Master Bond Inc. (US), Shin-Etsu Chemical Co., Ltd (Japan), LORD Corporation

  Market Summary The global demand for encapsulation resins stood at USD 3.67 billion in 2018, and the market is poised to exhibit a CAGR of over 3.4% during the forecast period. Furthermore, the growth is expected from the electrical and electronics industry due to increasing demand for consumer electronics and energy-efficient electrical and electronics manufacturing services (EMS). Additionally, the growing demand for automation in major end-use industries such as automotive, marine, construction, aerospace, and others is also expected to propel the demand for encapsulation resins during the forecast period. Segment Analysis The global  Encapsulation Resins Market Growth  has been segmented by product type, application, and end-use industry. The global market by product type has been classified into encapsulated epoxy resins, polyurethane resins, silicone resins, and others. The encapsulated epoxy resins and polyurethane resins together are expected to hold a share of over 60%