Encapsulation Resins Industry, Global Gross Margin Analysis, Industry Leading Players Update, Business Prospect and Industry Research Report 2027
Market Summary
The global demand for encapsulation resins stood at
USD 3.67 billion in 2018, and the market is poised to exhibit a CAGR of over
3.4% during the forecast period. Furthermore, the growth is expected from the
electrical and electronics industry due to increasing demand for consumer
electronics and energy-efficient electrical and electronics manufacturing
services (EMS). Additionally, the growing demand for automation in major
end-use industries such as automotive, marine, construction, aerospace, and
others is also expected to propel the demand for encapsulation resins during
the forecast period.
Segment Analysis
The global
encapsulation resins Industry has been segmented by product type, application,
and end-use industry. The global market by product type has been classified
into encapsulated epoxy resins, polyurethane resins, silicone resins, and
others. The encapsulated epoxy resins and polyurethane resins together are
expected to hold a share of over 60% of the global market during the forecast
period. Encapsulated epoxy resins exhibit excellent chemical and thermal
resistance; they are extensively used in the automotive, transportation, and
construction industries. In 2018, epoxy resins accounted for USD 6.67 billion
with increasing application in the automotive and construction industries. The
others segment includes isocyanate-free resins, thermally conductive resins,
and UV encapsulation resins, which together hold less than 20% of the share of
the global market.
Encapsulation resin
offers insulation and protection for printed circuit boards (PCBs) and other
electronic components, which help in proper functioning of the elements in
various components such as transformers, sensors, coils, and others. The PCB
segment is expected to register a CAGR of 4.2% by 2024. The PCB transformers
segment is expected to exhibit a CAGR of over 6.88%, owing to both renewable and
non-renewable energy sources coupled with power distribution ability in the
energy industry. The increase in demand for medical devices is expected to fuel
the demand for different types of sensors used in medical devices such as
optical sensors, biosensors, touch sensors, image sensors, pressure sensors,
and temperature sensors. The sensors segment is expected to register the
highest CAGR during the forecast period.
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Based on end-use industry, the global market has
been segmented into building & construction, automotive, transportation,
electrical & electronics, marine, and others. The electrical &
electronics segment accounted for the largest market share in 2017 and is
expected to maintain its dominance throughout the forecast period. The
growing adoption of electronic devices and smart household appliances, decrease
in the price of entry-level electronic goods, and increasing adoption of
e-commerce platforms are expected to boost the growth of the global
encapsulation resins market during the forecast period.
Competitive Analysis
The key players operating in the global Encapsulation
Resins Industry include Aremco (US),
Hitachi Chemical Co., Ltd (Japan), Dow (US), BASF SE (Germany), ELANTAS GmbH
(Germany), H.B. Fuller Company (US), Master Bond Inc (US), Henkel AG & Co.
KGaA (Germany), Shin-Etsu Chemical Co., Ltd (Japan), MG Chemicals (US),
Huntsman International LLC (US), Robnor ResinLab Ltd (UK), Dymax Corporation
(US), LORD Corporation (US), and RBC Industries, Inc (US).
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